Importance

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Abstract

A composite semiconductor device comprises a multilayer wiring board, a plurality of resin-sealed semiconductor devices having external leads projecting from the opposite sides thereof and stacked one on another, on a multilayer wiring board, and contact plates provided with wiring lines on the inner surfaces thereof and disposed close to the opposite sides of the resin-sealed semiconductor devices, respectively, with the wiring lines in electrical contact with the external leads of the resin-sealed semiconductor devices, respectively. Since the resin-sealed semiconductor devices are stacked, the degree of integration of the resin-sealed semiconductor devices is multiplied by the number of the resin-sealed semiconductor devices so stacked. Since the resin-sealed semiconductor devices are electrically interconnected by the wiring lines of the contact plates, the multilayer wiring board need not be provided with any wiring for electrically interconnecting the resin-sealed semiconductor devices.

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First Claim