Method for encapsulating an integrated circuit using a removable heatsink support block
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United States of America Patent
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-
Sep 6, 1994
Grant Date -
N/A
app pub date -
Sep 22, 1992
filing date -
Sep 22, 1992
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A process for making thermosetting or thermoplastic encapsulated integrated circuit having a heat exchanger in which one end of the heat exchanger is encapsulated in the housing adjacent to the integrated circuit and the other end is exposed to the environment beyond the housing portion. The process of making includes molding a heat exchanger into a thermosetting or thermoplastic package utilizing a preformed heat exchanger having a dissolvable or removable material which serves as a seal block during the molding operation. A plurality of thermally conductive heat exchanger elements are provided for providing the desired thermal performance while reducing the thermal stresses in the package.
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