Multi-layer ceramic packages
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United States of America Patent
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Sep 6, 1994
Grant Date -
N/A
app pub date -
Jul 29, 1991
filing date -
Jul 29, 1991
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method for making multi-layer ceramic packages. The method provides for attaching contact pins to a ceramic substrate after the application of an intermediate metal layer and an outer metal layer. This eliminates plating the contact pins with an intermediate metal layer and an outer metal layer, thereby saving material and process time.
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