Method of cutting an aperture in a device by means of a laser beam
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Sep 6, 1994
Grant Date -
N/A
app pub date -
Mar 25, 1993
filing date -
Mar 25, 1993
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
The invention relates to a method of cutting an aperture in a device (1) by means of a laser beam (9), said device comprising a wall (2) having first (5) and second (6) opposing surfaces, and a third surface (7) separated from said wall (2) along the path (11) of said laser beam (9), said method comprising the steps of: (a) causing said laser beam (9) to be incident upon said first surface (10) so as to cut through said wall (2) and form said aperture, and (b) introducing fluid between said second (6) and third (7) surfaces in the path (11) of said laser beam (9) so as to thereby prevent damage to said third surface (7) when said laser beam has cut through said wall. The invention may be used to cut aperture in devices such as injector nozzles syringe needles, medical stents and fluid/air control valves.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully