Compact high density interconnected microwave system
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United States of America Patent
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Sep 6, 1994
Grant Date -
N/A
app pub date -
Apr 5, 1990
filing date -
Apr 5, 1990
priority date (Note) -
Expired
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Abstract
A multimodule microwave system is assembled in a physically compact, high reliability manner employing a high density interconnect structure to interconnect the different modules of a microwave system by rendering the portion of the interconnect structure between modules flexible and by folding the interconnect structure on appropriate sized mandrels between the modules to place the modules in a multi-tier physical stack. Shielding and hermetic packaging may also be provided.
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