Tungsten metallization of CVD diamond
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Sep 13, 1994
Grant Date -
N/A
app pub date -
Aug 2, 1993
filing date -
Aug 2, 1993
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A process for significantly improving the adhesion of a refractory metal deposited on diamond is disclosed. The process involves depositing an initial thin metal coating by low pressure chemical vapor deposition on diamond, heat treating in a non-oxidizing environment, and continuing the deposition of the initial metal coating until a desired thickness is achieved. Diamond sheets that have undergone the inventive process where 15 micrometers of tungsten are deposited, exhibit tungsten adhesive values in excess of 10,000 pounds per square inch.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully