Module comprising IC memory stack dedicated to and structurally combined with an IC microprocessor chip
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United States of America Patent
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Sep 13, 1994
Grant Date -
N/A
app pub date -
Dec 3, 1992
filing date -
Dec 3, 1992
priority date (Note) -
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Abstract
A computer module is disclosed in which a stack of glued together IC memory chips is structurally integrated with a microprocessor chip. The memory provided by the stack is dedicated to the microprocessor chip. The microprocessor and its memory stack may be connected either by glue and/or by solder bumps. The solder bumps can perform three functions--electrical interconnection, mechanical connection, and heat transfer. The electrical connections in some versions are provided by wire bonding.
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