Method for patterning a mold
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United States of America Patent
Stats
-
Sep 20, 1994
Grant Date -
N/A
app pub date -
May 3, 1993
filing date -
May 3, 1993
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A mold substrate having a major surface is provided. A patterned masking layer is formed on the major surface of the mold substrate that exposes portions of the major surface of the mold substrate while other portions are covered by the patterned masking layer. The major surface of the mold substrate is etched, thereby removing exposed portions of the major surface of the mold substrate, and thus transferring the pattern from the patterned masking layer to the major surface of the mold substrate.
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