Electrostatic chuck for high power plasma processing
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United States of America Patent
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Sep 27, 1994
Grant Date -
N/A
app pub date -
Dec 2, 1992
filing date -
Dec 2, 1992
priority date (Note) -
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status (Latency Note)
Importance
Abstract
An electrostatic chuck for holding an article to be processed in a plasma reaction chamber and comprising a metal pedestal coated with a layer of dielectric material in which is formed a cooling gas distribution system for passing and distributing a cooling gas between the upper surface of the layer and the article when supported on the pedestal. The gas distribution system comprises a plurality of intersecting grooves formed entirely in the upper surface of the layer with small gas distribution holes through intersections of the grooves over upper ends of cooling gas receiving holes formed in an underside of the pedestal.
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