Film carrier semiconductor device
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Sep 27, 1994
Grant Date -
N/A
app pub date -
Oct 28, 1992
filing date -
Nov 12, 1991
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A film carrier semiconductor device includes a film carrier tape, an outer lead bonding bump mounting portion, a semiconductor chip, inner lead bonding leads, and outer lead bonding bumps. The film carrier tape consists of a tape-like insulating material and has carrying and positioning sprocket holes in its both edge portions. The outer lead bonding bump mounting portion is formed in a central portion of the film carrier tape. The semiconductor chip is mounted on the outer lead bonding bump mounting portion and has electrode bumps formed on electrode pads. The inner lead bonding leads are formed into a predetermined pattern on the film carrier tape and connected to the electrode bumps. The outer lead bonding bumps are formed on the outer lead bonding bump mounting portion, to each of which one end of a corresponding one of the inner lead bonding leads is connected.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully