Process for fabricating an active matrix circuit
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United States of America Patent
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Oct 4, 1994
Grant Date -
N/A
app pub date -
Mar 23, 1992
filing date -
Mar 23, 1992
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An improved method of fabricating integrated circuits, particularly active matrix arrays. The present method comprises applying an etch-resist pattern to an integrated circuit by printing to form resist patterns. The circuit is then etched, recoated with a different substance, a new ink pattern applied and the pattern repeated to form the successive layers of the integrated circuit.
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