Flip chip package and method of making
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United States of America Patent
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Oct 4, 1994
Grant Date -
N/A
app pub date -
Jan 4, 1993
filing date -
Jan 4, 1993
priority date (Note) -
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status (Latency Note)
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Abstract
A portion of a semiconductor die is rigidly flip chip bonded to a conductive base plate and portion is bonded to a flexible dielectric material to take advantage of the benefits of flip chip packaging while at the same time allowing for heat to be dissipated and for differential thermal expansion to be relieved. A semiconductor die having at least a first and a second bump formed thereon is rigidly connected to the base plate through the first bump and is flexibly connected to the base plate through the second bump.
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