A unitary heat sink and connector housing (10, 10', 10', 10'') is disposed between a pair of electrical members, such as printed circuit boards (11, 12, 31) and/or flexible etched circuits (32) in an overall assembly used in a variety of high-performance miniaturized electronic products. One or more flexible electrical connectors (21, 25, 26, 29, 30) are mounted within the unitary heat sink and connector housing (10, 10', 10', 10'') and provide a circuit interface between respective circuit elements or pads (13, 14) on the printed circuit boards (11, 12, 31) and/or flexible etched circuits (32), respectively. The unitary heat sink and connector housing (10, 10', 10', 10''), which preferably has heat-radiating fins (20), is made from a material which is thermally conductive but electrically non-conductive. Examples of such a material are anodized aluminum, silicon dioxide and beryllium oxide. Any suitable ceramic material could be used.
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An application with the status "Published" (which means it is pending) may be recently abandoned, but not yet updated to reflect its abandoned status. However, an application filed less than one year ago is unlikely to be abandoned.
A patent with the status "Granted" may be recently expired, but not yet updated to reflect its expired status. However, it is highly unlikely a patent less than 3.5 years old would be expired.
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