System for controlling an integrated product process for semiconductor wafers and packages
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United States of America Patent
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Oct 11, 1994
Grant Date -
N/A
app pub date -
Mar 6, 1992
filing date -
Mar 6, 1992
priority date (Note) -
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Abstract
A distributed control system for controlling an integrated production process for semiconductor wafers and packages. A workstation is connected to a tester and a sorter/handler for configuring and controlling both devices. An operator need not be aware of different syntaxes and configurations required by different brands of testers, sorters/probers or handlers. The workstation is connected to a computer-aided manufacturing node to obtain setup and other processing control information and to send updated control information to the node through a network. If the data collected from the testers indicates low yield, the computer-aided manufacturing node is alerted.
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