Method of protecting aluminum nitride circuit substrates during electroless plating using sol-gel oxide films and article made therefrom
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Oct 25, 1994
Issued Date -
N/A
app pub date -
Aug 10, 1993
filing date -
Sep 4, 1991
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
The present invention describes a process for protecting aluminum nitride circuit substrates during electroless plating using a sol-gel technique. The aluminum nitride substrate is coated with a metal. The coated substrate is etched to form a circuit pattern thereby exposing the aluminum nitride. The etched substrate is placed in a solution of tetraethylorthosilicate and withdrawn. The substrate is dried in air and then baked in an oven to remove all of the organic solvents leaving a stoichio metric film of silica on the exposed substrate. The substrate is then placed in an electroless plating solution and the circuit pattern is plated to a predetermined thickness.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully