Method for manufacture of printed circuit boards
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United States of America Patent
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Oct 25, 1994
Grant Date -
N/A
app pub date -
Dec 6, 1993
filing date -
Dec 6, 1993
priority date (Note) -
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Abstract
A method for the manufacture of printed circuit boards is provided comprising conditioning the board, activating with a catalytic metal, post-activating, stabilizing and etching the copper surfaces before the desired circuit is formed on the board. This process eliminates the need for a flash coating of copper in the through holes before the use of protective coatings such as imaging resists and soldermasks.
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