Manufacture of printed circuit conductors by a partially additive process
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United States of America Patent
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Oct 25, 1994
Grant Date -
N/A
app pub date -
Mar 24, 1993
filing date -
Mar 24, 1993
priority date (Note) -
Expired
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Abstract
The adhesion of epoxy-resin containing resist compositions to a copper surface, which resist compositions are exposed to actinic radiation, developed and hardened, is enhanced by contacting the copper surface with an N-heterocyclic compound comprising --NH.sub.2 groups and drying the copper surface comprising the N-heterocyclic compound prior to application of the resist. Printed wiring boards produced by a partially additive process can be produced using this adhesion enhancement technique.
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