Die-attach composition comprising polycyanate ester monomer
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United States of America Patent
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Oct 25, 1994
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N/A
app pub date -
Feb 26, 1993
filing date -
Feb 26, 1993
priority date (Note) -
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Abstract
In accordance with the present invention, there is provided a novel composition for attaching a semiconductor device to a substrate. The invention composition comprises liquid polycyanate ester monomer, electrically conductive filler rendered substantially free of catalytically active metal ions and a curing catalyst. Treatment of filler to render it free of catalytically active metal ions significantly extends the pot life of the composition.
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