Apparatus for bonding external leads of an integrated circuit
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United States of America Patent
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Oct 25, 1994
Issued Date -
N/A
app pub date -
Feb 18, 1992
filing date -
Feb 18, 1992
priority date (Note) -
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Abstract
A hot bar apparatus for effecting solder bonds for high density electronic components has a diamond or diamond-like (i.e. a generally diamond crystal lattice with graphite impurities) surface that makes contact with the leads of the electronic component and transmits the heat necessary to effect a solder bond. The diamond or diamond-like surface has superior wear characteristics over any other material, and it also is an electrical insulator to protect the electronic components from spurious voltages and currents generated by electrical currents that provide the heat for the hot bar.
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