Three dimensional multi-chip module with integral heat sink
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United States of America Patent
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Oct 25, 1994
Grant Date -
N/A
app pub date -
Jul 9, 1993
filing date -
Jul 9, 1993
priority date (Note) -
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status (Latency Note)
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Abstract
The invention is to a three dimensional circuit module constructed around a heat sink 10. A large integrated circuit component 21 such as a Micro Processing Unit for a computer is mounted over contact pads 27 on a printed wiring board 20. Also mounted to contact pads 27 on the printed wiring board are submodules 11, 12, 24, 25 that have wiring patterns interconnected to other circuit components 13-17, such as high power memory devices. The printed circuit submodules are mounted on the sides of the heat sink.
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