Importance

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Abstract

A programmable multichip module (MCM) base substrate includes a first patterned signal layer comprising a plurality of electrical conductors formed in a first direction and a second patterned signal comprising a second plurality of electrical conductors formed perpendicular to the first group, thus forming a grid. The two signal layers are electrically insulated from each other as well as the substrate surfaces. A first plurality of vias provides openings from the surface of the base substrate to the first signal layer, and a second plurality of vias provide openings in the surface of the base substrate to the second signal layer. Substrate programming is accomplished utilizing via plate-up and surface metalization techniques to establish connections between conductors residing in the two signal layers and to define surface contact pads, and utilizing masking and etching procedures to cut open selected conductors at unmasked via sites.

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First Claim