Two piece assembly for the selection of pinouts and bond options on a semiconductor device
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United States of America Patent
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Nov 1, 1994
Issued Date -
N/A
app pub date -
Apr 1, 1994
filing date -
Dec 20, 1991
priority date (Note) -
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status (Latency Note)
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Abstract
The invention comprises a semiconductor package which allows pinouts and bond options to be customized after the encasement of a die in plastic, ceramic, or other suitable materials. A first embodiment of the invention has a first assembly comprising an encapsulated die having bond pads connected to bond wires which terminate in exterior pad portions on the exterior of the encapsulant. Conductive paths which are part of a second assembly electrically connect with the exterior pad portions of the first assembly and pass signals to device pinouts, which can be leads or other connecting means, to an electronic device into which the module is installed. By selectively connecting the exterior pad portions of the first assembly to the connection points of the conductive paths of the second assembly, the device pinouts and bond options can be selected. To manufacture a device having different pinouts or bond options, a bottom section having a different design is used.
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