A cleaning apparatus for cleaning the reverse surface of a semiconductor wafer has a pair of holders for holding the wafer therebetween such that the wafer is kept substantially horizontal with the major surface directed upward. The holders can be moved close to each other and away from each other in the horizontal direction, and be moved in the vertical direction. A rotary brush is brought into contact with the reverse surface of the wafer held between the holders. The rotary brush can be rotated about its center, and be revolved substantially about the center of the wafer. The shaft of the brush is connected to a flexible pipe. Pure water as cleaning water and drying nitrogen gas of about 200.degree. C. are selectively supplied to the reverse surface of the wafer through the flexible pipe. Cleaning nitrogen gas as a barrier gas is supplied to the major surface of the wafer so as to prevent a contaminant from being scattered from the reverse surface and attached to the major surface.
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