Plastic package with solder grid array
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United States of America Patent
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-
Nov 8, 1994
Issued Date -
N/A
app pub date -
Jul 26, 1993
filing date -
Jul 26, 1993
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Solderable connections are formed in a grid array pattern on the surface of a plastic package by modifying conventional lead frame assemblies so that the outer ends of the leads terminate at the bottom surface of the package and forming solder pads or balls on the ends of the leads. Conventional lead frames are used and, after modification, are encapsulated using conventional plastic packaging techniques to form plastic packages with solderable terminal ends arranged in an interconnection array on one surface of the package.
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