US Patent No: 5,362,681

Number of patents in Portfolio can not be more than 2000

Method for separating circuit dies from a wafer

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Abstract

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A method for separating individual dies from a wafer in which the wafer is adhered to a plastic film on a film carrier with the circuit side of the wafer facing the film and with circuit components exposed through a hole in the film. In this manner, the circuitry is protected from dust, and trauma from the sawing and cleaning processes because the circuitry is sealed between the film and the non-circuit side of the wafer.

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First Claim

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Patent Owner(s)

Patent OwnerAddressTotal Patents
ANALOG DEVICES, INC.NORWOOD, MA2420

International Classification(s)

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  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Long, Lewis H Woburn, MA 1 95
Roberts, Jr Carl M Topsfield, MA 5 357
Ruggerio, Paul A Peabody, MA 4 124

Cited Art Landscape

Patent Info (Count) # Cites Year
 
INTERNATIONAL BUSINESS MACHINES CORPORATION (1)
5,171,717 Method for batch cleaving semiconductor wafers and coating cleaved facets 34 1991
 
Nitto Electric Industrial Co., Ltd. (1)
4,522,679 Apparatus for sticking adhesive film on a ring and a thin article 14 1984
 
SGS-THOMSON MICROELECTRONICS, INC. (1)
4,915,565 Manipulation and handling of integrated circuit dice 51 1989

Patent Citation Ranking

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Patent Info (Count) # Cites Year
 
MICRON TECHNOLOGY, INC. (20)
5,904,546 Method and apparatus for dicing semiconductor wafers 86 1996
6,250,192 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions 13 1996
5,913,104 Method and apparatus to hold integrated circuit chips onto a chuck and to simultaneously remove multiple integrated circuit chips from a cutting chuck 6 1997
6,119,675 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions 19 1998
6,155,247 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions 13 1999
6,006,739 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions 33 1999
6,196,096 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions 8 1999
6,401,580 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions 12 2000
6,255,196 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions 4 2000
6,279,563 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions 0 2000
6,427,676 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions 14 2001
6,631,662 Apparatus for sawing wafers employing multiple indexing techniques for multiple die dimensions 2 2001
6,459,105 Apparatus for sawing wafers employing multiple indexing techniques for multiple die dimensions 3 2001
6,423,616 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions 0 2001
6,691,696 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions 5 2001
6,578,458 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions 10 2002
6,687,990 Sawing method employing multiple indexing techniques and semiconductor device structures fabricated thereby 6 2002
6,897,571 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions 0 2002
6,932,077 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions and dicing apparatus 2 2003
7,387,119 Dicing saw with variable indexing capability 0 2005
 
AMKOR TECHNOLOGY, INC. (13)
6,465,329 Microcircuit die-sawing protector and method 26 1999
6,444,499 Method for fabricating a snapable multi-package array substrate, snapable multi-package array and snapable packaged electronic components 153 2000
6,441,504 Precision aligned and marked structure 18 2000
6,309,943 Precision marking and singulation method 22 2000
6,563,204 Microcircuit die-sawing protector 2 2000
6,610,167 Method for fabricating a special-purpose die using a polymerizable tape 12 2001
6,572,944 Structure for fabricating a special-purpose die using a polymerizable tape 2 2001
6,420,776 Structure including electronic components singulated using laser cutting 14 2001
6,399,463 Method of singulation using laser cutting 29 2001
6,943,429 Wafer having alignment marks extending from a first to a second surface of the wafer 3 2001
6,869,861 Back-side wafer singulation method 12 2001
6,580,153 Structure for protecting a micromachine with a cavity in a UV tape 2 2001
6,661,080 Structure for backside saw cavity protection 5 2001
 
ANALOG DEVICES, INC. (10)
6,303,409 Methods for separating microcircuit dies from wafers 1999
7,022,546 Method and device for protecting micro electromechanical systems structures during dicing of a wafer 4 2001
6,946,326 Method and device for protecting micro electromechanical systems structures during dicing of a wafer 3 2001
6,946,366 Method and device for protecting micro electromechanical systems structures during dicing of a wafer 3 2001
6,759,273 Method and device for protecting micro electromechanical systems structures during dicing of a wafer 9 2001
6,555,417 Method and device for protecting micro electromechanical system structures during dicing of a wafer 46 2001
7,521,363 MEMS device with non-standard profile 0 2004
7,416,984 Method of producing a MEMS device 7 2004
7,939,932 Packaged chip devices with atomic layer deposition protective films 2 2008
8,343,369 Method of producing a MEMS device 0 2011
 
DENSO CORPORATION (8)
6,255,741 Semiconductor device with a protective sheet to affix a semiconductor chip 56 1999
6,429,506 Semiconductor device produced by dicing 42 2000
6,444,543 Semiconductor sensor device and method of manufacturing the same 14 2001
6,787,866 Semiconductor device having a moveable member therein and a protective member disposed thereon 5 2002
7,005,313 Semiconductor dynamic sensor, and methods of transport and collet suction for the same 0 2004
7,091,109 Semiconductor device and method for producing the same by dicing 4 2004
7,298,022 Semiconductor sensor 1 2005
7,678,589 Semiconductor device for providing capacitive semiconductor sensor and method for manufacturing capacitive semiconductor sensor 1 2007
 
TESSERA, INC. (6)
6,182,546 Apparatus and methods for separating microelectronic packages from a common substrate 7 1998
6,228,685 Framed sheet processing 26 1998
6,217,972 Enhancements in framed sheet processing 32 1998
6,338,982 Enhancements in framed sheet processing 16 2000
6,541,852 Framed sheets 19 2001
7,152,311 Enhancements in framed sheet processing 17 2001
 
TEXAS INSTRUMENTS INCORPORATED (4)
5,933,351 System and method for locating dies cut from a silicon wafer on a wafer table 12 1997
6,374,149 System and method for determining the center of a wafer on a wafer table 1 1998
6,174,788 Partial semiconductor wafer processing with multiple cuts of random sizes 9 1999
6,156,625 Partial semiconductor wafer processing using wafermap display 14 1999
 
CANON KABUSHIKI KAISHA (2)
7,569,118 Method for dicing wafer and process for manufacturing liquid-discharging head using the dicing method 0 2005
7,837,820 Method for dicing wafer and process for manufacturing liquid-discharging head using the dicing method 0 2009
 
INTERMEDICS, INC. (2)
6,505,665 Method and apparatus for use in assembling electronic devices 4 1998
6,251,219 Method and apparatus for use in assembling electronic devices 1 1998
 
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (2)
5,939,132 Alignment chips positioned in the peripheral part of the semiconductor substrate and method of manufacturing thereof 8 1997
7,191,511 Electronic component placement machine having camera units with vertically overlaid apertures 1 2005
 
NATIONAL SEMICONDUCTOR CORPORATION (2)
5,832,585 Method of separating micro-devices formed on a substrate 16 1996
5,923,995 Methods and apparatuses for singulation of microelectromechanical systems 124 1997
 
ATOMIC ENERGY COUNCIL - INSTITUTE OF NUCLEAR ENERGY RESEARCH (1)
7,598,157 Wafer dicing method 0 2007
 
AXSUN TECHNOLOGIES, INC. (1)
6,420,206 Optical membrane singulation process utilizing backside and frontside protective coating during die saw 2 2001
 
CHECKPOINT SYSTEMS, INC. (1)
7,820,481 Rotary chip attach process 0 2009
 
DELPHI TECHNOLOGIES, INC. (1)
5,461,008 Method of preventing aluminum bond pad corrosion during dicing of integrated circuit wafers 34 1994
 
DISCO CORPORATION (1)
7,544,587 Wafer dividing method and wafer dividing apparatus 0 2007
 
EO TECHNICS CO., LTD. (1)
6,808,117 Method and apparatus for calibrating marking position in chip scale marker 4 2002
 
FICO INTERNATIONAL B.V. (1)
8,677,592 Methods for separating electronic components utilizing a manipulator to transport the electronic components between first and second cutting tools 0 2006
 
FLIPCHIP INTERNATIONAL (1)
5,632,667 No coat backside wafer grinding process 29 1995
 
FUJITSU LIMITED (1)
6,716,665 Method of mounting chip onto printed circuit board in shortened working time 5 2001
 
GENERAL SEMICONDUCTOR, INC. (1)
6,283,693 Method and apparatus for semiconductor chip handling 48 1999
 
KABUSHIKI KAISHA TOSHIBA (1)
7,294,558 Method and apparatus for cleaving a wafer through expansion resulting from vaporization or freezing of liquid 0 2005
 
KERWAR ACQUISITIONS LLC (1)
7,008,819 Method of fabricating an array of wafer scale polymeric caps 1 2004
 
KNOWLES ELECTRONICS, LLC (1)
7,297,567 Method for singulating a released microelectromechanical system wafer 0 2006
 
LUCENT TECHNOLOGIES INC. (1)
5,899,730 Method of handling semiconductor wafers, bars and chips 7 1997
 
New Wave Research (1)
8,822,882 Scribing sapphire substrates with a solid state UV laser with edge detection 0 2005
 
PANASONIC CORPORATION (1)
6,830,989 Method and apparatus for handling arrayed part 3 2002
 
PRINCETON OPTRONICS, INC. (1)
7,065,112 Wavelength locker 4 2003
 
ROBERT BOSCH GMBH (1)
5,628,855 Method of picking up an electric device 3 1995
 
ROHM CO., LTD. (1)
5,494,549 Dicing method 8 1993
 
SEIKO INSTRUMENTS INC. (1)
6,107,163 Method of manufacturing a semiconductor chip 3 1998
 
SEMIKRON ELEKTRONIK GMBH & CO. KG (1)
8,662,377 Method for securing electronic components to a substrate 0 2005
 
SONY CORPORATION (1)
5,641,714 Method of manufacturing members 47 1996
 
SUMCO CORPORATION (1)
5,976,954 Method and apparatus for cleaning and separating wafers bonded to a fixing member 1 1997
 
VANGUARD INTERNATIONAL SEMICONDUCTOR CORPORATION (1)
5,827,394 Step and repeat exposure method for loosening integrated circuit dice from a radiation sensitive adhesive tape backing 34 1997
 
Westinghouse Electric Corp. (1)
6,083,811 Method for producing thin dice from fragile materials 47 1996
 
Other [Check patent profile for assignment information] (1)
6,493,934 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions 0 2001