Method for separating circuit dies from a wafer

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 5362681
SERIAL NO

07918665

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

A method for separating individual dies from a wafer in which the wafer is adhered to a plastic film on a film carrier with the circuit side of the wafer facing the film and with circuit components exposed through a hole in the film. In this manner, the circuitry is protected from dust, and trauma from the sawing and cleaning processes because the circuitry is sealed between the film and the non-circuit side of the wafer.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

Patent OwnerAddressTotal Patents
ANALOG DEVICES, INC.NORWOOD, MA2689

International Classification(s)

  • [Classification Symbol]
  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Long, Lewis H Woburn, MA 1 95
Roberts, Jr Carl M Topsfield, MA 5 404
Ruggerio, Paul A Campbell, CA 4 126

Cited Art Landscape

Patent Info (Count) # Cites Year
 
Nitto Electric Industrial Co., Ltd. (1)
* 4522679 Apparatus for sticking adhesive film on a ring and a thin article 14 1984
 
GLOBALFOUNDRIES INC. (1)
* 5171717 Method for batch cleaving semiconductor wafers and coating cleaved facets 38 1991
 
SGS-THOMSON MICROELECTRONICS, INC. (1)
* 4915565 Manipulation and handling of integrated circuit dice 53 1989
* Cited By Examiner

Patent Citation Ranking

Forward Cite Landscape

Patent Info (Count) # Cites Year
 
WESTINGHOUSE ELECTRIC CORPORATION (1)
* 6083811 Method for producing thin dice from fragile materials 50 1996
 
Other [Check patent profile for assignment information] (8)
6493934 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions 0 2001
* 2002/0068,384 Enhancements in framed sheet processing 9 2001
* 2004/0031,476 Group encapsulated dicing chuck 1 2003
* 2004/0183,910 Method and apparatus for handling arrayed components 2 2004
* 2005/0186,761 Group encapsulated dicing chuck 0 2005
* 2007/0228,112 Method and arrangement for forming a microelectronic package 2 2006
* 2007/0068,504 Group encapsulated dicing chuck 1 2006
* 2007/0062,511 Group encapsulated dicing chuck 0 2006
 
ATOMIC ENERGY COUNCIL - INSTITUTE OF NUCLEAR ENERGY RESEARCH (1)
* 7598157 Wafer dicing method 0 2007
 
SONY CORPORATION (1)
* 5641714 Method of manufacturing members 50 1996
 
New Wave Research (2)
* 8822882 Scribing sapphire substrates with a solid state UV laser with edge detection 0 2005
* 2005/0279,740 Scribing sapphire substrates with a solid state UV laser with edge detection 4 2005
 
PANASONIC CORPORATION (1)
* 6830989 Method and apparatus for handling arrayed part 3 2002
 
DISCO CORPORATION (2)
* 7544587 Wafer dividing method and wafer dividing apparatus 0 2007
* 2007/0164,073 Wafer dividing method and wafer dividing apparatus 4 2007
 
X-FAB SEMICONDUCTOR FOUNDRIES AG (1)
* 2007/0031,989 Separating semiconductor wafers having exposed micromechanical structures into individual chips 2 2004
 
MICRON TECHNOLOGY, INC. (20)
* 5904546 Method and apparatus for dicing semiconductor wafers 122 1996
6250192 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions 14 1996
* 5913104 Method and apparatus to hold integrated circuit chips onto a chuck and to simultaneously remove multiple integrated circuit chips from a cutting chuck 6 1997
* 6119675 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions 23 1998
* 6155247 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions 13 1999
* 6006739 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions 33 1999
6196096 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions 8 1999
6401580 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions 12 2000
6255196 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions 4 2000
6279563 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions 0 2000
6427676 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions 15 2001
6631662 Apparatus for sawing wafers employing multiple indexing techniques for multiple die dimensions 2 2001
6459105 Apparatus for sawing wafers employing multiple indexing techniques for multiple die dimensions 3 2001
6423616 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions 0 2001
6691696 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions 7 2001
6578458 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions 16 2002
6687990 Sawing method employing multiple indexing techniques and semiconductor device structures fabricated thereby 6 2002
6897571 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions 1 2002
6932077 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions and dicing apparatus 2 2003
7387119 Dicing saw with variable indexing capability 0 2005
 
EO TECHNICS CO., LTD. (1)
* 6808117 Method and apparatus for calibrating marking position in chip scale marker 4 2002
 
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (1)
* 2006/0046,434 Method for reducing lead precipitation during wafer processing 2 2004
 
SEIKO INSTRUMENTS INC. (1)
* 6107163 Method of manufacturing a semiconductor chip 3 1998
 
FICO INTERNATIONAL B.V. (1)
* 8677592 Methods for separating electronic components utilizing a manipulator to transport the electronic components between first and second cutting tools 0 2006
 
SUMCO CORPORATION (1)
* 5976954 Method and apparatus for cleaning and separating wafers bonded to a fixing member 1 1997
 
AMKOR TECHNOLOGY, INC. (13)
6465329 Microcircuit die-sawing protector and method 28 1999
6444499 Method for fabricating a snapable multi-package array substrate, snapable multi-package array and snapable packaged electronic components 176 2000
6441504 Precision aligned and marked structure 21 2000
* 6309943 Precision marking and singulation method 22 2000
6563204 Microcircuit die-sawing protector 10 2000
6610167 Method for fabricating a special-purpose die using a polymerizable tape 12 2001
6572944 Structure for fabricating a special-purpose die using a polymerizable tape 2 2001
6420776 Structure including electronic components singulated using laser cutting 15 2001
6399463 Method of singulation using laser cutting 33 2001
* 6943429 Wafer having alignment marks extending from a first to a second surface of the wafer 9 2001
* 6869861 Back-side wafer singulation method 15 2001
* 6580153 Structure for protecting a micromachine with a cavity in a UV tape 3 2001
* 6661080 Structure for backside saw cavity protection 6 2001
 
KABUSHIKI KAISHA TOSHIBA (2)
* 7294558 Method and apparatus for cleaving a wafer through expansion resulting from vaporization or freezing of liquid 0 2005
* 2005/0196,899 Method and apparatus for cleaving a wafer through expansion resulting from vaporization or freezing of liquid 1 2005
 
TESSERA, INC. (6)
6182546 Apparatus and methods for separating microelectronic packages from a common substrate 7 1998
6228685 Framed sheet processing 30 1998
6217972 Enhancements in framed sheet processing 43 1998
6338982 Enhancements in framed sheet processing 20 2000
6541852 Framed sheets 27 2001
7152311 Enhancements in framed sheet processing 22 2001
 
VANGUARD INTERNATIONAL SEMICONDUCTOR CORPORATION (1)
* 5827394 Step and repeat exposure method for loosening integrated circuit dice from a radiation sensitive adhesive tape backing 35 1997
 
FICO SINGULATION B.V. (1)
* 2008/0289,165 Device and Method for Separating Electronic Components 0 2006
 
CANON KABUSHIKI KAISHA (5)
* 7569118 Method for dicing wafer and process for manufacturing liquid-discharging head using the dicing method 0 2005
* 2005/0241,754 Method for dicing wafer and process for manufacturing liquid-discharging head using the dicing method 4 2005
* 7837820 Method for dicing wafer and process for manufacturing liquid-discharging head using the dicing method 0 2009
* 2009/0242,111 METHOD FOR DICING WAFER AND PROCESS FOR MANUFACTURING LIQUID-DISCHARGING HEAD USING THE DICING METHOD 1 2009
* 2011/0027,970 METHOD FOR DICING WAFER AND PROCESS FOR MANUFACTURING LIQUID-DISCHARGING HEAD USING THE DICING METHOD 0 2010
 
INTERMEDICS, INC. (2)
6505665 Method and apparatus for use in assembling electronic devices 4 1998
6251219 Method and apparatus for use in assembling electronic devices 2 1998
 
LUCENT TECHNOLOGIES INC. (1)
* 5899730 Method of handling semiconductor wafers, bars and chips 7 1997
 
NYTELL SOFTWARE LLC (1)
* 7008819 Method of fabricating an array of wafer scale polymeric caps 1 2004
 
AXSUN TECHNOLOGIES LLC (1)
6420206 Optical membrane singulation process utilizing backside and frontside protective coating during die saw 3 2001
 
PRINCETON OPTRONICS INC. (2)
7065112 Wavelength locker 5 2003
* 2004/0228,375 Wavelength locker 8 2003
 
FUJITSU LIMITED (1)
6716665 Method of mounting chip onto printed circuit board in shortened working time 5 2001
 
SHINKO ELECTRIC INDUSTRIES CO., LTD. (1)
* 2004/0175,903 Semiconductor device fabrication method 0 2004
 
ANALOG DEVICES, INC. (16)
6303409 Methods for separating microcircuit dies from wafers 0 1999
7022546 Method and device for protecting micro electromechanical systems structures during dicing of a wafer 6 2001
6946326 Method and device for protecting micro electromechanical systems structures during dicing of a wafer 6 2001
6946366 Method and device for protecting micro electromechanical systems structures during dicing of a wafer 4 2001
6759273 Method and device for protecting micro electromechanical systems structures during dicing of a wafer 13 2001
6555417 Method and device for protecting micro electromechanical system structures during dicing of a wafer 58 2001
* 2002/0081,816 Method and device for protecting micro electromechanical systems structures during dicing of a wafer 2 2001
* 2002/0076,848 Method and device for protecting micro electromechanical systems structures during dicing of a wafer 91 2001
7521363 MEMS device with non-standard profile 0 2004
* 7416984 Method of producing a MEMS device 7 2004
* 2006/0027,885 MEMS device with non-standard profile 1 2004
* 2006/0027,522 Method of producing a MEMS device 0 2004
* 2008/0225,505 Method of producing a MEMS device 1 2008
7939932 Packaged chip devices with atomic layer deposition protective films 4 2008
* 2008/0315,334 Packaged chip devices with atomic layer deposition protective films 6 2008
8343369 Method of producing a MEMS device 0 2011
 
FLIPCHIP INTERNATIONAL (1)
* 5632667 No coat backside wafer grinding process 31 1995
 
GENERAL SEMICONDUCTOR, INC. (1)
* 6283693 Method and apparatus for semiconductor chip handling 50 1999
 
DENSO CORPORATION (10)
6255741 Semiconductor device with a protective sheet to affix a semiconductor chip 62 1999
6429506 Semiconductor device produced by dicing 45 2000
6444543 Semiconductor sensor device and method of manufacturing the same 17 2001
6787866 Semiconductor device having a moveable member therein and a protective member disposed thereon 5 2002
* 7005313 Semiconductor dynamic sensor, and methods of transport and collet suction for the same 0 2004
* 2004/0187,575 Semiconductor dynamic sensor, and methods of transport and collet suction for the same 0 2004
7091109 Semiconductor device and method for producing the same by dicing 4 2004
7298022 Semiconductor sensor 1 2005
7678589 Semiconductor device for providing capacitive semiconductor sensor and method for manufacturing capacitive semiconductor sensor 1 2007
* 2007/0289,384 Semiconductor device for providing capacitive semiconductor sensor and method for manufacturing capacitive semiconductor sensor 1 2007
 
NATIONAL SEMICONDUCTOR CORPORATION (2)
* 5832585 Method of separating micro-devices formed on a substrate 19 1996
* 5923995 Methods and apparatuses for singulation of microelectromechanical systems 149 1997
 
DELPHI TECHNOLOGIES, INC. (1)
* 5461008 Method of preventing aluminum bond pad corrosion during dicing of integrated circuit wafers 36 1994
 
ROBERT BOSCH GMBH (1)
* 5628855 Method of picking up an electric device 3 1995
 
KNOWLES ELECTRONICS, LLC (1)
7297567 Method for singulating a released microelectromechanical system wafer 11 2006
 
ROHM CO., LTD. (1)
* 5494549 Dicing method 10 1993
 
TEXAS INSTRUMENTS INCORPORATED (4)
* 5933351 System and method for locating dies cut from a silicon wafer on a wafer table 12 1997
* 6374149 System and method for determining the center of a wafer on a wafer table 5 1998
* 6174788 Partial semiconductor wafer processing with multiple cuts of random sizes 10 1999
* 6156625 Partial semiconductor wafer processing using wafermap display 15 1999
 
SEMIKRON ELEKTRONIK GMBH & CO. KG (2)
* 8662377 Method for securing electronic components to a substrate 0 2005
* 2005/0247,760 Method for securing electronic components to a substrate 5 2005
 
CHECKPOINT SYSTEMS, INC. (2)
* 7820481 Rotary chip attach process 0 2009
* 2009/0269,882 ROTARY CHIP ATTACH 0 2009
 
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (2)
* 5939132 Alignment chips positioned in the peripheral part of the semiconductor substrate and method of manufacturing thereof 8 1997
* 7191511 Electronic component placement machine having camera units with vertically overlaid apertures 1 2005
* Cited By Examiner