Printed circuit board or card thermal mass design

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 5363280
SERIAL NO

08050589

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A multi-layer printed circuit board or card including at least one passage in at least one of the layers of the circuit board or card for preventing the diffusion of heat throughout the circuit board or card during the securing or removal of components in plated through holes in the circuit board or card by the heating of the plating material to a temperature above a melting point of the plating material.

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First Claim

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Patent Owner(s)

Patent OwnerAddress
INTERNATIONAL BUSINESS MACHINES CORPORATIONNEW ORCHARD ROAD ARMONK NY 10504

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chobot, Ivan I Whitby, CA 3 94
Covert, John A Binghamton, NY 4 306
Haight, Randy L Waverly, NY 2 87
Mansfield, Keith D New Milford, PA 2 87
Miller, Donald W Newark Valley, NY 38 338
Neira, Reinaldo A Endicott, NY 2 87
Petrovich, Alexander Endicott, NY 3 110
Sviedrys, Paul C Great Neck, NY 2 87
Tiemann, Louise A Endwell, NY 2 87
Valenta, Gerald A Haw River, NC 2 87
Youngs, Jr Thurston B Vestal, NY 7 248

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