Method for fabricating microstructures using temporary bridges
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United States of America Patent
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Nov 15, 1994
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N/A
app pub date -
Aug 4, 1993
filing date -
Aug 4, 1993
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Abstract
A method and apparatus for forming bridges between surfaces of a suspended microstructure and other surfaces of the suspended microstructure or particularly placed anchors on the die in order to increase the stiffness and lateral strength of the microstructure during fabrication. Once fabrication is completed, the bridges are cut by a laser thus fully releasing the microstructure into its final suspended and resilient condition.
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