Method for rapid plasma treatments
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United States of America Patent
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Nov 15, 1994
Issued Date -
N/A
app pub date -
Oct 25, 1993
filing date -
Sep 27, 1991
priority date (Note) -
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Abstract
A plasma treating apparatus is useful for coating substrates with thin films having vapor barrier properties at relatively rapid deposition rates. The apparatus comprises an evacuable chamber, an electrically powered electrode defining a plasma-facing surface within the chamber, and a shield spaced a distance .DELTA. transverse to the plasma-facing surface. During plasma treatments, the plasma is confined to within distance .DELTA. while a substrate is continuously fed through the confined plasma.
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