Resin mold semiconductor device
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United States of America Patent
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-
Nov 15, 1994
Grant Date -
N/A
app pub date -
Sep 27, 1993
filing date -
Oct 27, 1992
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A first lead frame A has an island 21 on which a semiconductor chip 24 is mounted. The major surface of the island that is opposite to the major surface on which the semiconductor chip 24 is mounted is exposed to the outside of a resin member. A second lead frame B includes a distortion preventing member 26 having substantially the same shape as the island 21 of the first lead frame A. The major surface of the distortion preventing member 26 that is opposite to the major surface facing the island 21 is exposed to the outside of the resin member. The semiconductor chip 24 is located between the island 21 and the distortion preventing member 26. Thus, the semiconductor device has low thermal resistance, and its final shape has no distortion.
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