US Patent No: 5,365,106

Number of patents in Portfolio can not be more than 2000

Resin mold semiconductor device

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Importance

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Abstract

A first lead frame A has an island 21 on which a semiconductor chip 24 is mounted. The major surface of the island that is opposite to the major surface on which the semiconductor chip 24 is mounted is exposed to the outside of a resin member. A second lead frame B includes a distortion preventing member 26 having substantially the same shape as the island 21 of the first lead frame A. The major surface of the distortion preventing member 26 that is opposite to the major surface facing the island 21 is exposed to the outside of the resin member. The semiconductor chip 24 is located between the island 21 and the distortion preventing member 26. Thus, the semiconductor device has low thermal resistance, and its final shape has no distortion.

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First Claim

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Patent Owner(s)

Patent OwnerAddressTotal Patents
KABUSHIKI KAISHA TOSHIBATOKYO36337

International Classification(s)

  • [Classification Symbol]
  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Watanabe, Toshiya Kita-kyushu, JP 49 1133

Cited Art

Patent Info (Count) # Cites Year
 
FREESCALE SEMICONDUCTOR, INC. (2)
5,173,764 Semiconductor device having a particular lid means and encapsulant to reduce die stress 56 1991
5,252,783 Semiconductor package 24 1992
 
KABUSHIKI KAISHA TOSHIBA (1)
5,223,739 Plastic molded semiconductor device having waterproof cap 58 1990

Patent Citation Ranking

Forward Cites

Patent Info (Count) # Cites Year
 
AMKOR TECHNOLOGY, INC. (116)
6,798,046 Semiconductor package including ring structure connected to leads with vertically downset inner ends 10 2002
6,833,609 Integrated circuit device packages and substrates for making the packages 7 2003
6,965,159 Reinforced lead-frame assembly for interconnecting circuits within a circuit module 4 2003
6,750,545 Semiconductor package capable of die stacking 13 2003
6,927,483 Semiconductor package exhibiting efficient lead placement 24 2003
6,794,740 Leadframe package for semiconductor devices 4 2003
7,095,103 Leadframe based memory card 0 2003
6,879,034 Semiconductor package including low temperature co-fired ceramic substrate 4 2003
7,045,396 Stackable semiconductor package and method for manufacturing same 77 2003
7,008,825 Leadframe strip having enhanced testability 24 2003
6,876,068 Semiconductor package with increased number of input and output pins 44 2003
6,897,550 Fully-molded leadframe stand-off feature 3 2003
7,485,952 Drop resistant bumpers for fully molded memory cards 0 2003
6,873,041 Power semiconductor package with strap 16 2003
7,071,541 Plastic integrated circuit package and method and leadframe for making the package 1 2003
7,245,007 Exposed lead interposer leadframe package 44 2003
7,057,280 Leadframe having lead locks to secure leads to encapsulant 4 2003
6,998,702 Front edge chamfer feature for fully-molded memory cards 7 2003
6,846,704 Semiconductor package and method for manufacturing the same 10 2003
6,967,395 Mounting for a package containing a chip 12 2003
6,893,900 Method of making an integrated circuit package 1 2003
7,138,707 Semiconductor package including leads and conductive posts for providing increased functionality 5 2003
7,144,517 Manufacturing method for leadframe and for semiconductor package using the leadframe 3 2003
7,211,879 Semiconductor package with chamfered corners and method of manufacturing the same 4 2003
6,965,157 Semiconductor package with exposed die pad and body-locking leadframe 9 2003
7,115,445 Semiconductor package having reduced thickness 1 2004
7,057,268 Cavity case with clip/plug for use on multi-media card 3 2004
7,091,594 Leadframe type semiconductor package having reduced inductance and its manufacturing method 7 2004
7,170,150 Lead frame for semiconductor package 2 2004
6,844,615 Leadframe package for semiconductor devices 7 2004
7,005,326 Method of making an integrated circuit package 5 2004
7,190,062 Embedded leadframe semiconductor package 24 2004
7,067,908 Semiconductor package having improved adhesiveness and ground bonding 4 2004
7,211,471 Exposed lead QFP package fabricated through the use of a partial saw process 43 2004
7,598,598 Offset etched corner leads for semiconductor package 0 2004
7,202,554 Semiconductor package and its manufacturing method 14 2004
7,045,882 Semiconductor package including flip chip 7 2004
6,953,988 Semiconductor package 18 2004
7,217,991 Fan-in leadframe semiconductor package 8 2004
7,253,503 Integrated circuit device packages and substrates for making the packages 41 2004
7,001,799 Method of making a leadframe for semiconductor devices 2 2004
7,064,009 Thermally enhanced chip scale lead on chip semiconductor package and method of making same 7 2004
7,030,474 Plastic integrated circuit package and method and leadframe for making the package 2 2004
7,176,062 Lead-frame method and assembly for interconnecting circuits within a circuit module 0 2005
7,214,326 Increased capacity leadframe and semiconductor package using the same 4 2005
7,247,523 Two-sided wafer escape package 15 2005
6,995,459 Semiconductor package with increased number of input and output pins 49 2005
7,192,807 Wafer level package and fabrication method 17 2005
7,045,883 Thermally enhanced chip scale lead on chip semiconductor package and method of making same 5 2005
7,507,603 Etch singulated semiconductor package 8 2005
7,361,533 Stacked embedded leadframe 20 2005
7,572,681 Embedded electronic component package 19 2005
7,112,474 Method of making an integrated circuit package 1 2005
7,564,122 Semiconductor package and method of making using leadframe having lead locks to secure leads to encapsulant 1 2006
8,410,585 Leadframe and semiconductor package made using the leadframe 0 2006
7,535,085 Semiconductor package having improved adhesiveness and ground bonding 2 2006
7,902,660 Substrate for semiconductor device and manufacturing method thereof 15 2006
7,968,998 Side leaded, bottom exposed pad and bottom exposed lead fusion quad flat semiconductor package 2 2006
7,321,162 Semiconductor package having reduced thickness 0 2006
7,332,375 Method of making an integrated circuit package 0 2006
7,521,294 Lead frame for semiconductor package 5 2006
7,714,431 Electronic component package comprising fan-out and fan-in traces 20 2006
7,687,893 Semiconductor package having leadframe with exposed anchor pads 3 2006
7,829,990 Stackable semiconductor package including laminate interposer 1 2007
7,982,297 Stackable semiconductor package having partially exposed semiconductor die and method of fabricating the same 1 2007
7,420,272 Two-sided wafer escape package 16 2007
7,723,210 Direct-write wafer level chip scale package 6 2007
7,977,774 Fusion quad flat semiconductor package 3 2007
7,687,899 Dual laminate package structure with embedded elements 6 2007
7,777,351 Thin stacked interposer package 24 2007
8,089,159 Semiconductor package with increased I/O density and method of making the same 0 2007
7,847,386 Reduced size stacked semiconductor package and method of making the same 0 2007
7,560,804 Integrated circuit package and method of making the same 1 2008
7,956,453 Semiconductor package with patterning layer and method of making same 1 2008
7,723,852 Stacked semiconductor package and method of making same 4 2008
8,067,821 Flat semiconductor package with half package molding 2 2008
7,768,135 Semiconductor package with fast power-up cycle and method of making same 3 2008
7,808,084 Semiconductor package with half-etched locking features 1 2008
8,125,064 Increased I/O semiconductor package and method of making same 0 2008
8,184,453 Increased capacity semiconductor package 1 2008
7,692,286 Two-sided fan-out wafer escape package 20 2008
7,847,392 Semiconductor device including leadframe with increased I/O 5 2008
7,989,933 Increased I/O leadframe and semiconductor device including same 1 2008
8,008,758 Semiconductor device with increased I/O leadframe 3 2008
8,089,145 Semiconductor device including increased capacity leadframe 1 2008
8,072,050 Semiconductor device with increased I/O leadframe including passive device 0 2008
7,875,963 Semiconductor device including leadframe having power bars and increased I/O 3 2008
7,982,298 Package in package semiconductor device 1 2008
8,058,715 Package in package device for RF transceiver module 1 2009
7,732,899 Etch singulated semiconductor package 0 2009
8,026,589 Reduced profile stackable semiconductor package 5 2009
7,960,818 Conformal shield on punch QFN semiconductor package 0 2009
7,928,542 Lead frame for semiconductor package 1 2009
7,977,163 Embedded electronic component package fabrication method 2 2009
8,089,141 Semiconductor package having leadframe with exposed anchor pads 0 2010
7,872,343 Dual laminate package structure with embedded elements 1 2010
8,188,584 Direct-write wafer level chip scale package 0 2010
7,932,595 Electronic component package comprising fan-out traces 4 2010
8,324,511 Through via nub reveal method and structure 0 2010
7,906,855 Stacked semiconductor package and method of making same 1 2010
8,294,276 Semiconductor device and fabricating method thereof 0 2010
8,084,868 Semiconductor package with fast power-up cycle and method of making same 0 2010
8,319,338 Thin stacked interposer package 0 2010
8,440,554 Through via connected backside embedded circuit features structure and method 0 2010
8,299,602 Semiconductor device including leadframe with increased I/O 0 2010
8,283,767 Dual laminate package structure with embedded elements 0 2010
8,188,579 Semiconductor device including leadframe having power bars and increased I/O 1 2010
8,390,130 Through via recessed reveal structure and method 0 2011
8,318,287 Integrated circuit package and method of making the same 0 2011
8,102,037 Leadframe for semiconductor package 0 2011
8,119,455 Wafer level package fabrication method 1 2011
8,441,110 Side leaded, bottom exposed pad and bottom exposed lead fusion quad flat semiconductor package 0 2011
8,304,866 Fusion quad flat semiconductor package 0 2011
8,432,023 Increased I/O leadframe and semiconductor device including same 0 2011
8,227,921 Semiconductor package with increased I/O density and method of making same 0 2011
8,298,866 Wafer level package and fabrication method 0 2012
 
MICRON TECHNOLOGY, INC. (20)
5,734,198 Multi-layer lead frame for a semiconductor device 36 1997
6,054,754 Multi-capacitance lead frame decoupling device 28 1997
5,965,936 Multi-layer lead frame for a semiconductor device 3 1997
6,515,359 Lead frame decoupling capacitor semiconductor device packages including the same and methods 4 1998
6,114,756 Interdigitated capacitor design for integrated circuit leadframes 9 1998
6,472,737 Lead frame decoupling capacitor, semiconductor device packages including the same and methods 4 1999
6,124,630 Multi-layer lead frame for a semiconductor device 5 1999
6,184,574 Multi-capacitance lead frame decoupling device 21 1999
6,265,764 Interdigitated capacitor design for integrated circuit lead frames 9 2000
6,307,255 Multi-layer lead frame for a semiconductor device 4 2000
6,310,388 Semiconductor die assembly having leadframe decoupling characters 10 2000
6,396,134 Interdigitated capacitor design for integrated circuit lead frames 4 2001
6,504,236 Semiconductor die assembly having leadframe decoupling characters and method 11 2001
6,515,353 Multi-layer lead frame for a semiconductor device 0 2001
6,531,765 Interdigitated capacitor design for integrated circuit lead frames and method 7 2002
6,781,219 Semiconductor die assembly having leadframe decoupling characters 6 2002
6,730,994 Interdigitated capacitor design for integrated circuit lead frames and methods 4 2002
6,717,257 Lead frame decoupling capacitor, semiconductor device packages including the same and methods 1 2002
7,071,542 Lead frame decoupling capacitor, semiconductor device packages including the same and methods 0 2002
6,707,136 Multi-layer lead frame for a semiconductor device 0 2002
 
RENESAS ELECTRONICS CORPORATION (5)
5,914,531 Semiconductor device having a ball grid array package structure using a supporting frame 32 1997
6,114,192 Method of manufacturing a semiconductor device having a ball grid array package structure using a supporting frame 18 1998
6,150,715 Semiconductor device with radiation plate for high radiation character and method of manufacturing the same 6 1998
6,686,226 Method of manufacturing a semiconductor device a ball grid array package structure using a supporting frame 2 2000
6,861,294 Semiconductor devices and methods of making the devices 2 2003
 
INTERNATIONAL RECTIFIER CORPORATION (3)
6,075,286 Stress clip design 12 1998
6,717,260 Clip-type lead frame for source mounted die 11 2002
6,924,175 Clip-type lead frame for source mounted die 1 2004
 
FAIRCHILD SEMICONDUCTOR CORPORATION (2)
6,762,067 Method of packaging a plurality of devices utilizing a plurality of lead frames coupled together by rails 36 2000
7,821,116 Semiconductor die package including leadframe with die attach pad with folded edge 0 2007
 
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (2)
6,208,020 Leadframe for use in manufacturing a resin-molded semiconductor device 174 1999
6,338,984 Resin-molded semiconductor device, method for manufacturing the same, and leadframe 18 2001
 
INFINEON TECHNOLOGIES AG (1)
8,129,225 Method of manufacturing an integrated circuit module 0 2007
 
MITSUBISHI DENKI KABUSHIKI KAISHA (1)
5,592,019 Semiconductor device and module 225 1995
 
Siliconix incorporated (1)
6,249,041 IC chip package with directly connected leads 74 1998
 
VISHAY-SILICONIX (1)
7,589,396 Chip scale surface mount package for semiconductor device and process of fabricating the same 1 2007