In situ resist control during spray and spin in vapor
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United States of America Patent
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-
Nov 22, 1994
Grant Date -
N/A
app pub date -
Oct 30, 1992
filing date -
Oct 30, 1992
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Spin coating of resist on a semiconductor wafer is done in a controlled chamber, starting with introducing a resist solvent vapor into the chamber from a nozzle, applying the resist by spraying a very thin layer of the resist material, monitoring and adjusting the resist thickness during spinning in vapor, and then removing solvent from the chamber. The result is a saving in resist material and enhanced coating uniformity.
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