Method of making a multi-layer circuit assembly
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United States of America Patent
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Nov 29, 1994
Grant Date -
N/A
app pub date -
Dec 31, 1991
filing date -
Dec 31, 1991
priority date (Note) -
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status (Latency Note)
Importance
Abstract
A multi-layer circuit panel assembly is formed by laminating circuit panels with interposers incorporating flowable conductive material at interconnect locations and a flowable dielectric materials at locations other than the interconnect locations. Excess materials are captured in reservoirs such as within vias in the circuit panels and apertures in interior elements within the interposers. The flowable materials of the interposers, together with the reservoirs, allow the interposers to compress and take up tolerances in the components. The flowable dielectric material encapsulates conductors on the surfaces of the circuit panels.
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