Wavesoldering device and procedure
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United States of America Patent
Stats
-
Nov 29, 1994
Grant Date -
N/A
app pub date -
Oct 5, 1990
filing date -
Apr 19, 1988
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Printed circuit boards are wavesoldered by a method featuring the use of a plurality of elementary jets of molten solder to form a single flat soldering wave. Such a single flat wave is achieved by revolving those jets in an orbital motion such that the orbital motion is in a horizontal plane substantially parallel to the printed circuit board. Such a method allows the removal of air/gas bubbles during wavesoldering from any side of a component that is attached to a printed circuit board.
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