Removing bubbles from small cavities
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United States of America Patent
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-
Nov 29, 1994
Grant Date -
N/A
app pub date -
Jul 26, 1993
filing date -
Jul 26, 1993
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
Bubbles are removed from small cavities, such as blind via holes in a semiconductor wafer, by immersing the article having the cavities in a liquid medium. A wetting agent is preferably present in the liquid medium. A vacuum is applied to the liquid medium, and the vacuum is vented to air. The application of vacuum and venting are repeated several times, causing the bubbles to be drawn from the cavities and to dislodge from the surface of the article. The bubbles float free, and processing within the cavities can commence.
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