Multi-layer printed circuit board apparatus and method for making same

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 5369219
SERIAL NO

08016043

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A multi-layer printed circuit board is disclosed as having more layers and greater accuracy in the conductive traces of those layers than has been previously possible. Using the disclosed multi-layer printed circuit boards can be built having a conductive path width of 0.5 mils (0.0127 mm) and spacing between such conductive traces of 0.5 mils (0.0127 mm). The method enables multi-layer boards to be created having more than eight layers, and still maintaining the desired 0.5 mil conductive path width and spacing. The enhanced accuracy and increased number of layers is made possible by use of adjustments to customer-supplied art work based upon evaluation of test pieces made early in the procedure. By use of the disclosed method, multi-layer printed circuit boards can he built having a high density of coaxial cable equivalents and tuned wave guide equivalents. An apparatus is also disclosed which connects the coaxial cable equivalents and tuned wave guide equivalents from one multi-layer printed circuit board to a second multi-layer printed circuit board.

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Patent Owner(s)

  • PROVIDENT BANK, THE;JAPLAR MONARCH COMPANY

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kerns, Robert Q Blanchester, OH 5 215

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