Method of mounting a semiconductor device to a heat sink
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United States of America Patent
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Dec 6, 1994
Issued Date -
N/A
app pub date -
Apr 19, 1993
filing date -
Jun 5, 1992
priority date (Note) -
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Abstract
A method of mounting a semiconductor device to a heat sink where an opening in the circuit board is formed and sized to allow the semiconductor device to pass therethrough, where a heat sink is positioned on one side of the circuit board and a load is introduced on a second side of the circuit board and applied to the semiconductor device forcing it against the heat sink.
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