Polyamide hollow filaments

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United States of America Patent

PATENT NO 5370935
SERIAL NO

08208911

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Abstract

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An improved process for preparing polyamide hollow filaments wherein an N,N'-dialkyl polycarbonamide is melt blended with the molten fiber-forming polyamide prior to spinning into filaments. The polycarbonamide substantially decreases the collapsing of the voids which naturally occurs immediately .after spinning and before the filaments are completely cool.

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Patent Owner(s)

Patent OwnerAddress
INVISTA NORTH AMERICA S A R L4417 LANCASTER PIKE INTELLECTUAL PROPERTY RECORD CENTER-722/032 WILMINGTON DE 19805

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Agarwal, Nirmal K Seaford, DE 9 115
Longhi, Raymond Seaford, DE 6 76
Rao, Sundar M Seaford, DE 10 125

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