Semiconductor member and process for preparing semiconductor member
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United States of America Patent
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Dec 6, 1994
Grant Date -
N/A
app pub date -
Aug 5, 1991
filing date -
Aug 3, 1990
priority date (Note) -
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Abstract
A process for preparing a semiconductor member by forming a member having a non-porous monocrystalline semiconductor region on a porous monocrystalline semiconductor region, bonding the insulating surface of a member to the surface of the non-porous monocrystalline semiconductor region, and then removing the porous monocrystalline semiconductor region by etching.
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