Method of uniformly encapsulating a semiconductor device in resin
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United States of America Patent
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-
Dec 6, 1994
Grant Date -
N/A
app pub date -
Apr 30, 1992
filing date -
May 27, 1991
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A molding method in which a control plate having a size which is equal to or larger than the width of the outlet port of a supply passage are disposed in a cavity adjacent to the resin supply passage of a mold and thereby, the resin molding can be effected substantially equally at upper and lower sides of the insert comprising a semiconductor device and a lead.
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