Importance

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Abstract

An interconnect structure contains a substrate, a layer of separate conductive leads extending over the substrate in one direction, and another layer of separate conductive leads extending over the substrate in another, substantially different, direction. At least one conductive lead in each of the layers of conductive leads is divided into at least two electrically separate conductive segments. A plurality of cells are formed in the substrate. Each cell has a number of bonding pads formed above the substrate region where the cell is situated for allowing integrated circuit chips and/or electronic components to be connected to the cells. Programmable elements, typically programmed by devices in the substrate, enable connections to be formed between selected ones of the conductive leads or segments, thus enabling the integrated circuit chips and electronic components to be electrically interconnected. Devices formed in the substrate typically allow testing of the various components connected to the substrate to determine their performance and to check the integrity of the connections formed between the conductive leads or segments.

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First Claim