Importance

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Abstract

A low-cost, highly-responsive temperature sensor has a thermistor element surface-mounted in a circuit defined by an electrically-conducting layer of a three-layer circuit substrate to be in close thermal coupling to a metal base layer on an opposite side of the substrate. The base layer is adapted to be disposed in heat-collecting relation to a surface whose temperature is to be monitored. An intermediate layer of the substrate has a binder electrically insulating the thermistor from the metal base layer and has thermally-conducting particles dispersed in the binder to improve thermal coupling of the thermistor to the heat-collecting substrate base layer. The circuit defines terminal pads surface-mounting the thermistor element at one end of the substrate and defines interconnected terminal pads at an opposite end of the substrate which are connected to device lead wires in substantial thermal isolation from the thermistor element.

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First Claim