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Abstract

An improved electrical interconnect system for a flexible circuit which includes: a flexible first layer; at least one protrusion on the flexible first layer that has an electrical contact; a second layer having at least one electrical contact; and a spring apparatus coupled to the flexible first layer and to the second layer for pressing the electrical contact on the protrusion on the flexible first layer to the electrical contact on the second layer to electrically connect the electrical contact on the protrusion to the electrical contact on the second layer. In a specific embodiment the spring apparatus for pressing the electrical contact on the protrusion of the flexible first layer to the electrical contact on the second layer includes relief for allowing the flexible first layer to deform during assembly of the improved electrical interconnect system for a flexible circuit. In an alternate specific embodiment the electrical contacts on the protrusions on the flexible first layer and the corresponding electrical contacts on the second layer are coated with gold. In another alternate specific embodiment the improved electrical interconnect system includes an alignment apparatus coupled to the flexible first layer and the second layer and the spring apparatus for aligning the flexible first layer with the second layer and the spring apparatus. The improved electrical interconnect system for a flexible circuit provides higher interconnect density, reduced cost and increased reliability compared to conventional interconnect systems.

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