Process for creating organic polymeric substrate with copper

United States of America Patent

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Dec 13, 1994
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N/A
app pub date
Dec 24, 1992
filing date
Dec 24, 1992

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Expired

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Abstract

A copper layer is coated onto an organic polymeric substrate in the presence of a gas containing nitrogen and a noble gas.

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Patent Owner	Address
INTERNATIONAL BUSINESS MACHINES CORPORAITON (IBM)	ARMONK NY 10504

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Inventor Name	Address	# of filed Patents	Total Citations
Blackwell, Kim J	Owego, NY	13	300
Knoll, Allan R	Endicott, NY	9	141
Matienzo, Luis J	Endicott, NY	50	405

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Process for creating organic polymeric substrate with copper

Number of patents in Portfolio can not be more than 2000

United States of America Patent

07996606

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PATENT NO	5372848
SERIAL NO	07996606
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