Die attach adhesive film, application method and devices incorporating the same
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United States of America Patent
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Dec 13, 1994
Issued Date -
N/A
app pub date -
Jul 12, 1993
filing date -
Mar 20, 1990
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A microelectronic device containing one or more dies bonded to a substrate 0.5-8 mil thick thermoplastic adhesive film is disclosed. The adhesive's main constituent is a thermoplastic organic high polymer containing the elements of carbon and hydrogen, and one or more of the elements oxygen, nitrogen, sulfur, halogen in its repeating unit. The polymer's Vicat softening temperature is 30.degree.280.degree. C., preferably 70.degree.-230.degree. C. The adhesive may also contain up to 45 volume percent of a thermally conductive inorganic filler of 0.5-20 micrometer particle size. The attachment process simply consists of heating and pressing the film, sandwiched between the adherent surfaces, above the melting temperature and cooling to ambient.
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