Ra-tab array bump tab tape based I.C. package
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Dec 20, 1994
Grant Date -
N/A
app pub date -
Dec 2, 1992
filing date -
Dec 2, 1992
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An electronic package assembly that includes a flexible circuit wrapped around a metal substrate. The leads of the flexible circuit are connected to an integrated circuit that is mounted to the top surface of the substrate. The flexible circuit has a plurality of metal pads located adjacent to the bottom surface of the substrate. The flexible circuit also contains a power/ground plane and a number of conductive signal lines that couple the integrated circuit to the metal pads. The pads can be soldered to a printed circuit board to electrically couple the integrated circuit to the board.
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