Method of manufacturing a printed circuit board
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United States of America Patent
Stats
-
Dec 27, 1994
Grant Date -
N/A
app pub date -
Aug 23, 1993
filing date -
Aug 23, 1993
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method of depositing a conductive material on a surface of a printed circuit board, includes the steps of chemically treating at least a portion of a surface of the printed circuit board, disposing a resist layer over the chemically treated surface, depositing a conductive layer in the areas which are not covered by the resist, stripping the resist from the surface of the printed circuit board, and cleaning exposed chemically treated surfaces of the printed circuit board to remove contaminants from the surface of the printed circuit board which were introduced in the chemically treating step.
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