Direct metallization process
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United States of America Patent
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Dec 27, 1994
Grant Date -
N/A
app pub date -
Oct 15, 1991
filing date -
Oct 15, 1991
priority date (Note) -
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Abstract
A direct metallization process is disclosed wherein plastic substrates may be electrolytically plated without the need for any prior electroless plating. The process uses a specially formulated post-activator composition at an elevated temperature to treat the activated substrate comprising either an alkaline solution containing an effective amount of metal ions which undergo a disproportionation reaction or an alkaline solution containing a metal ion such as Cu.sup.+2.
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