Ultra high density integrated circuit packages method and apparatus
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Dec 27, 1994
Issued Date -
N/A
app pub date -
Dec 17, 1993
filing date -
Aug 1, 1990
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
Thin and durable level-one and level-two integrated circuit packages are provided. A plurality of level-one integrated circuit packages may be aligned and securely bound in a stacked configuration by use of a flexible high temperature material, such as silicon adhesive tape or a conformal coating, to form a thin and durable horizontal level-two package, or stack. Various thermal conductors may be thermally coupled to the level-two package to help dissipate heat.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully