Apparatus mounting a power semiconductor to a heat sink
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United States of America Patent
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-
Dec 27, 1994
Grant Date -
N/A
app pub date -
Jan 26, 1993
filing date -
Jan 26, 1993
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An apparatus and a method of mounting a power semiconductor (10) to an external heat sink (18) when both fastening faces (11, 13) of the semiconductor are inaccessible during the assembly process. The apparatus comprises a nut plate (20) that mates with the semiconductor (10) and a thermally conductive layer (28) that engages the nut plate (20) and wraps around the semiconductor (10) in a captive manner. The external heat sink (18) threadably engages the nut plate (20) without the need to access either fastening face (11, 13) of the semiconductor (10).
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