Hybrid circuits and a method of manufacture
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United States of America Patent
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Jan 3, 1995
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N/A
app pub date -
Dec 22, 1993
filing date -
Dec 22, 1993
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Abstract
A method of manufacturing high connectivity ceramic multichip modules (MCM-C) using previously fired ceramic substrates, thick film dielectric layers and laser drilled vias. The laser energy is controlled in proportion to the thickness of the dielectric layer so that vias penetrate through the dielectric layers, but do not penetrate the underlying conductors. To minimize laser damage to the underlying conductors, the dielectric composition comprises fillers or pigments selected to absorb light at the wavelength emitted by the laser.
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