Method for removing organic film
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United States of America Patent
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Jan 3, 1995
Issued Date -
N/A
app pub date -
Aug 23, 1993
filing date -
Oct 9, 1990
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The method for removing organic film according to the present invention is very effective for removing a photo resist film in a process for manufacturing semiconductor device. A substrate (32) having a photo resist film (31) formed on it is processed in a wet processing tank (34) filled with a processing solution such as a mixed solution containing sulfuric acid and hydrogen peroxide or by a dry processing using oxygen plasma. Then, it is processed in an ozone processing tank (34) filled with a solution where ozone or ozone water has been infused, and the organic film is removed.
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